CYRASYS WS0S

Preliminary Concept

Specs:

Key Applications

N/a

Motherboard

N/a

Chassis:

N/a

Processor & Memory

- | Single Socket H5 (LGA-1200)
- | Up to 8C/16T; Up to 16MB Cache
- | Supports up to 95W TDP CPUs (Air Cooled)
- | Slot Count: 4 DIMM slots
- | Max Memory (2DPC): Up to 128GB 3200MT/s ECC DDR4 UDIMM

Dimensions and Weight

N/a

Expansion Slots 

- | 1 PCIe 4.0 x16 FHFL slot

Drive Bays / Storage 

- | Total 4x 3.5" Hotswap bays SATA (6Gbps)

System Cooling

- | 2x 80 Fans

System BIOS/BMC

- | AMI 256MB SPI Flash
- | ASPEED AST2600 BMC

On-Board Devices

- | 2 USB 2.0 Type-A ports(rear)
- | 1 VGA port
- | 1 TPM header
- | 2 RJ45 1GbE with Intel® I210-AT

Power Supply

- | 2x 1200W Redundant (1 + 1) Titanium Level (96%) PSU

Operating Environment

- | Operating Temperature Range: 5°C - 35°C
- | Non-Operating Temperature Range: 40°C - 70°C
- | Operating Relative Humidity Range: 8% - 90%
(non-condensing)
- | Non Operating Relative Humidity Range: 5% - 95%
(non-condensing)

Security

- | Trusted Platform Module (TPM) 2.0

Compliance

- | RoHS Compliant 

Compatible Parts

1USP3P | 1U Passive CPU Heat Sink, SP3, up to 95 Watt
1USP3A | 1U Active CPU Heatsink, SP3, up to 105 Watt

1USP3A | 1U Active CPU Heatsink, SP3, up to 105 Watt

1USP3A | 1U Active CPU Heatsink, SP3, up to 105 Watt

1USP3A | 1U Active CPU Heatsink, SP3, up to 105 Watt

1USP3A | 1U Active CPU Heatsink, SP3, up to 105 Watt

1USP3A | 1U Active CPU Heatsink, SP3, up to 105 Watt